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Submitted July 15, 2019
Published 2003-07-07

Artículos

Vol. 5 No. 2 (2003): Tecnociencia

RECUBRIMIENTOS CATÓDICOS DE COBRE SOBRE MATRICES DE ACERO, A PARTIR DE SOLUCIONES DE DIFOSFATO A pH 9


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Citación:
DOI: ND

Published: 2003-07-07

How to Cite

Rodríguez, J. L., Vásquez B., S. and Bósquez, A. F. (2003) “RECUBRIMIENTOS CATÓDICOS DE COBRE SOBRE MATRICES DE ACERO, A PARTIR DE SOLUCIONES DE DIFOSFATO A pH 9”, Tecnociencia, 5(2), pp. 73–85. Available at: https://revistas.up.ac.pa/index.php/tecnociencia/article/view/635 (Accessed: 28 September 2024).

Abstract

The effect of several experimental parameters has been examined on the quality and yield of the cathodically deposited copper on stainless and low carbon steel, from diphosphatic solutions at pH 9. The study was centered on the influence of the cathodic potential, the current density, the temperature of the electrolyte, the duration of the electrolysis and the mechanical agitation. A plateau, corresponding to the copper deposition was located by means of linear voltammetry, between –1125 and –1275 mV (S.C.E.), being the better potential of reduction –1175 mV, when the experiment carried out without heating y stirring. It was observed a linear relation between the amount of the deposited copper and the time. The rise of temperature accelerate the reaction, nevertheless, already from 30ºC was observed in same cases the decline the cathodic layer’s aspect, with incorporation of gas bubbles underneath the covering, particularly when the electrolysis was carried out without stirring. In addition, the copper anode was covered with a brown substance, presumptively Cu2O. The mechanical stirring has a remarkable accelerating effect on the speed of the reaction. In order to clarify, which is the factor that really influences the mechanism and properties of the covering, it was carried out some experiments in galvanostatic regime, with and without heating, with and without stirring and in combination of both parameters. It could been deduce, that the increase of the current density is the main responsible for the covering’s spoil, nevertheless also at low current density the high temperature have a negative influence on the electrodeposited copper.

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